PRELIMINARY PROGRAM



INTERNATIONAL SYMPOSIUM ON

ADHESION ASPECTS OF THIN FILMS AND ADHESION MEASUREMENT OF FILMS AND COATINGS

To be held November 5-7, 2001 at the Robert Treat Hotel; Newark, NJ

This symposium replaces what was originally intended to be two separate symposia dealing with adhesion aspects of thin films and adhesion measurement of thin films and coatings. However, tragic events associated with the destruction of the WORLD TRADE CENTER in New York City have forced many to change their travel plans and the organizing committee has had to respond by integrating the former two programs into one. As the two programs are so closely related combining them presents relatively little difficulty. The first topic is concerned with those aspects of thin film technology that have a direct bearing on film adhesion to the substrate. It is an area of both fundamental interest to thin film technology and of great practical concern in applications where films of high stress are involved. The coating of diamond films onto machine tools is one of many applications where thin films adhesion is a critical factor in coating durability. The second topic deals with the myriad methods for measuring the adhesion of thin films and coatings. The ability to accurately measure the adhesion of coatings to surfaces is a crucial part of the development and manufacturing process of coatings and films. In addition, the ability to make accurate adhesion measurements requires a fundamental understanding of the physics, chemistry and mechanics of thin films and coatings.



The invited speakers represent widely differing disciplines and interests, and they hail from academic, governmental and industrial research laboratories. The primary focus of this symposium is to provide a forum for the discussion of cutting edge advancements in the field and to review and consolidate the accomplishments which have been achieved thus far. Please note that the address given is that of the primary speaker and may not be correct for that of all coauthors.


HARD COATINGS

Esteban Broitman; Thin Film Physics Division, IFM, Linköping University, SE-581 83 Linköping, SWEDEN; Hard and Elastic Carbon Nitride Films for Tribological Applications



Tsutomu Sonoda, A.Watazu, J.Zhu, W.Shi, A.Kamiya, K.Kato and T.Asahina

National Institute of Advanced Industrial Science and Technology(AIST)

1-1, Hirate-cho, Kita-ku, Nagoya 462-8510, JAPAN; Improved Adhesion of Ti-O Film deposited onto Titanium-based Alloy by Reactive Sputtering with Ti/O Compositional Gradient





S.J. Bull; Materials Division, Department of Mechanical, Materials and Manufacturing Engineering, University of Newcastle, Herschel Building, Newcastle-upon-Tyne, NE1 7RU, UK; Assessing the Adhesion of Hard, Carbon-based Coatings



Alfred Hofrichter; Ecole Polytechnique, Paliseau, FRANCE; Distribution of Silicon Oxynitrides on Polycarbonate by Distributed Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition



Shoji Kamiya, Hironori Takahashi, Pierangelo D'Antonio, Riccardo Polini and Enrico Traversa; Department of Mechanical Engineering - Tohoku University, Aramaki aza Aoba 01, Aoba-ku, Sendai 980-8579, JAPAN; Quantitative Evaluation of the Interface Toughness Between CVD Diamond and Co-cemented Tungsten Carbide



MULTILAYERS AND INTERFACIAL PHENOMENA



G. Grundmeier, B. Schinkinger, N. Shirtcliffe, P. Thiemann, M. Stratmann; Max-Planck-Institut für Eisenforschung, Düsseldorf, GERMANY; Morphology and Chemical Composition of Interfacial Ultra-Thin Inorganic and Organic Layers at Paint/Metal Interfaces



A. Lahmar, D. Sakami, S. Orain, Y. Scudeller, F. Danes and T.P. Nguyen; Laboratoire de Thermocinétique, UMR CNRS 6607, Ecole Polytechnique de l'Université de Nantes, BP 50609, 44306 Nantes cedex 3, FRANCE; Study of Adhesion and Thermal Contact Resistance of Gold and Copper Films On Alumina Substrates



Gyeong-Su Park; Samsung Advanced Institute of Technology, P.O. Box 111, Suwon 440-600, SOUTH KOREA; Structural Analysis of Hybrid Thin Multilayers on Polymeric Substrates Studied by Transmission Electron Microscopy



Norbert Schwesinger; Microstructured Mechatronical Systems, Munich University of Technolgy, Arcisstrasse 21, D-80290 Munich, GERMANY; Adhesion Aspects of Thin Films in the Field of Micro Reaction Technology



Michael Ignat; Inst. Natl. Polytechnique Grenoble, BP 75, Domaine Universitaire, F-38402 St. Martin d'Heres, FRANCE; Determination of the Elastic Parameters and of the Tensile Strength of an Intermetallic Thin Layer Obtained by Solid State Reaction



Xingfa Ma, Yuanjun Liu, Fenghua Song , Lei Tang, Zhongping Wang and Jianguo Wang; Shandong Institute of Non-metallic Materials, P.O.Box 108,Jinan250031, PEOPLES REPUBLIC OF CHINA; Studies on the Interface of Rubber-to-Metal Bonded Composite with SEM



Xingfa Ma, Fenghua Song, Lei Tang, Zhongping Wang and Jianguo Wang; Shandong Institute of Non-metallic Materials, P.O.Box 108, Jinan 250031, PEOPLES REPUBLIC OF CHINA; Dynamical Simulation Test Studies of Metal-to-Rubber Bonding in Vulcanization Composites



Zhiming Yu; Corrosion Science Laboratory, Inst. of Corrosion&Protection of Metals, Wencui Rd. 62, Shenyang 110015, P. R. CHINA; Influence of Interlayers and Microstress on Adherence of Tin Films



STRESS AND DEFECT PHENOMENA



Y. Leterrier and G. Rochat; Laboratoire de Technologie des Composites et Polymeres (LTC), Ecole Polytechnique Federale de Lausanne (EPFL), CH-1015 Lausanne, SWITZERLAND;

Influence of Defects and Internal Stresses on the Adhesion of Nanosized Oxide Coatings on Polymers



J. Bouchet and A. A. Roche; Institut National des Sciences Appliquées de Lyon, Laboratoire des Matériaux Macromoléculaires (CNRS, UMR 5627), 20 Avenue Albert Einstein, F-69621 Villeurbanne Cedex, FRANCE; How Residual Stresses and Mechanical Properties of Organic Coatings Applied onto Metallic Substrate Interphases: Do Affect Practical Adhesion?



S. Scaglione, A. Rizzo, M..A. Tagliente and M. Alvisi; ENEA, New Material Division, CR Brindisi, S.S.7 Appia Km 712, 72100 Brindisi, ITALY; A Study of Intrinsic Residual Stress in Silver Films Deposited by RF Magnetron Sputtering