CALL FOR PAPERS

SECOND INTERNATIONAL SYMPOSIUM ON

ADHESION ASPECTS

OF THIN FILMS

To be held November 5-7, 2001 at the

Robert Treat Hotel; Newark, NJ

This symposium is the follow on to the first symposium in this series which was also held in Newark, NJ in 1999. As with its predecessor, this symposium will be concerned with those aspects of thin film technology that have a direct bearing on film adhesion to the substrate. This is a topic of both fundamental interest to thin film technology and of great practical concern in applications where films of high stress are involved. The coating of diamond films onto machine tools is one of many applications where thin films adhesion is a critical factor in coating durability. This symposium is organized to bring together scientists, technologists and engineers interested in all aspects of thin film adhesion, to review and assess the current state of knowledge, to provide a forum for exchange and cross-fertilization of ideas and to define problem areas which need intensified efforts.

The invited speakers have been selected so as to represent widely differing disciplines and interests, and they hail from academic, governmental and industrial research laboratories. This meeting is planned to be a truly international event both in geographic coverage as well as in spirit. The technical program will contain both invited overviews and contributed original research papers. It is planned to chronicle the transactions in a hard-bound volume of archival quality (to match or exceed the standards of the journal literature) which will serve as a reference work for future generations of investigators.

BOTH ORGANIC AND INORGANIC THIN FILMS ARE OF INTEREST IRRESPECTIVE OF DEPOSITION METHOD

TOPICS OF INTEREST INCLUDE:

Factors influencing adhesion - Residual stress, mechanical properties, contamination ... etc.
Bond durability, corrosion prevention
Adhesion promoters

POLYMERIC FILMS

Plasma polymerized films
Photoresists

Organic insulators
Barrier layers

Effects of aging and environment on adhesion

GENERAL SYSTEMS:

Polymer to metal and metal to polymer adhesion
Multilevel laminates involving glass, ceramic, metal and polymer thin films

FUNDAMENTAL ISSUES

Role of surface chemistry, wettability and morphology
Fundamental adhesion mechanisms including film/substrate interactions

This symposium is being organized by MST Conferences, LLC under the direction of Dr. K. L. Mittal, Editor, Journal of Adhesion Science and Technology. A proceedings volume is planned for this symposium and further details will be provided in due course. Please notify the conference chairman of your intentions to present a paper as early as possible. An abstract of about 200 words should be sent by June 15, 2001 to the conference chairman by any of the following methods:

E-mail: rhl@mstconf.com

FAX: 212-656-1016

Regular mail:

Dr. Robert H. Lacombe

Conference Chairman

3 Hammer Drive

Hopewell Junction, NY 12533

Contact by phone: 845-226-1393

CLICK HERE TO SUBMIT AN ABSTRACT OR GET ON CONFERENCE MAILING LIST: ONLINE RESPONSE FORM

MST Conferences Webmaster
Your comments and inquiries are most welcome
Address all correspondence to:
rhlacombe@compuserve.com