F I N A L P R O G R A M

EIGHTH INTERNATIONAL SYMPOSIUM ON PARTICLES

ON SURFACES: DETECTION, ADHESION AND REMOVAL

Providence Biltmore Hotel, Providence, Rhode Island (USA); June 24-26, 2002

This will be the eighth event in the series of symposia on particles on surfaces initiated as part of the Fine Particle Society meeting in 1986. Particles are yield detractors in the manufacture of sophisticated and sensitive electronic components and are very undesirable in many other technologies. Contamination of optical surfaces and shorting of microelectronic circuits by conducting particles, among other concerns, underscore the importance of particle detection, adhesion and removal. On the other hand, however,

in certain instances particle adhesion to surfaces is necessary. The purpose of this symposium is to address the vast ramifications of particles on solid surfaces by bringing together specialists in many allied fields to discuss their latest findings and to identify areas for further investigation. Various types of substrates and particles, metals, oxides, glass, and polymers are covered. The technical program comprises both invited and contributed papers ranging from topical overviews to original research and industrial applications.

SESSION I: MONDAY, JUNE 24, 2002

8:30-8:35am: INTRODUCTORY REMARKS

8:35-9:05: P. A. Beaven, J. Knoth and H. Schwenke; GKSS-Forschungszentrum, P.O. Box 1160, D-21494 Geesthacht, GERMANY; Characterization of Particles on Surfaces using X- Ray Fluorescence Methods with Grazing Geometries

9:05-9:35: K. Xu¹, R. Vos¹, G. Vereecke¹, M. Lux¹, W. Fyen¹, F. Holsteyns¹, K. Kenis¹, P. Mertens¹, M. M. Heyns¹ and C. Vinckier² ; 1) IMEC vzw, Kapeldreef 75, B-3001 Leuven, BELGIUM; 2) Chem. Dept. of KULeuven, Celestijnenlaan 200F, B-3001 Leuven, BELGIUM; Nano-sized Particle Deposition and the Correlation Between Haze and Particle-count on Wafers

9:35-10:05: C. C. Walton, J. A. Folta, P. A. Kearney, J. C. Davidson, C. L. Larson, D. G. Stearns¹, D. W. Sweeney and P. B. Mirkarimi; Lawrence Livermore National Laboratory & Extreme Ultraviolet Lithography LLC, Livermore, CA 94550; 1) Orthosport, Inc.; Defect Production and Transport in an Ultra-Clean Ion-Beam Sputter Coating Process

10:05-10:30: COFFEE BREAK

10:30-11:00: Robert Small and Brandon Scott; EKC Technology, Inc., 2520 Barrington Ct., Hayward, CA 94545; Possible Post CMP Cleaning Processes for STI Ceria Slurries

11:00-11:30: Michael T. Andreas; Micron Technology, 8000 S. Federal Way, M/S 306, Boise, ID 83707; Performance Criteria for Copper Damascene Post-CMP Wafer Cleaning

11:30-12:00: F. Negri, E. Bedel and P. Schmitz; Institut de Mecanique des Fluides, UMR CNRS/INP-UPS 5502 , Allee du Professeur Camille SOULA, 31400 Toulouse, FRANCE; Surface Contamination by Alumina Particles

12:00-1:30: LUNCH

SESSION II: MONDAY, JUNE 24, 2002

1:30-2:00: Rajiv Kohli; Maxtor Corporation, 2452 Clover Basin Drive, Longmont, CO 80503; The Nature and Characterization of Small Particles

2:00-2:30: M. A. Melehy; Department of Electrical and Computer Engineering, University of Connecticut, Storrs, CT 06269-2157; Thermodynamic Theory of Adhesion of Particles on Surfaces

2:30-3:00: Kevin Kendall; Chemical Engineering, University of Birmingham, Edgbaston B15 2TT, UK; Adhesion of Nanoparticles

3:00-3:30: COFFEE BREAK

3:30-4:00: Juergen Tomas; Otto-von-Guericke-University Magdeburg, Mechanical Process Engineering, P.O. Box 4120, D - 39106 Magdeburg, GERMANY; Mechanics of Nanoparticle Adhesion

4:00-4:30: Sean Eichenlaub and Stephen P. Beaudoin; Arizona State University, Department of Chemical and Materials Engineering, Tempe, AZ 85287-6006; The Adhesion of Rough, Nonuniform Particles to Rough Surfaces

4:30-5:00: E.S.Geskin., B. Goldenberg and R. Caudill; New Jersey Institute of Technology, Newark, NJ 07102-1982; Development of a Technology for Glass Cleaning in the Course of Demanucturing of Electronic Products

SESSION III: TUESDAY, JUNE 25, 2002

8:30-9:00: David A. Cole¹, Marius Kendall², C. Sharyn Magee¹, Patrick J. McKeown¹, Vasil Pajcini², and Juergen H. Scherer³: 1) Evans East, 104 Windsor Center, Suite 101, East Windsor, NJ 08520; 2) Charles Evans & Associates, 810 Kifer Road, Sunnyvale, CA 94086; 3) Evans PHI, 6509 Flying Cloud Drive, Eden Prairie, MN 55344; Surface and Micro-Analytical Methods for Particle Identification

9:00-9:30: Karen Reinhardt; NOVELLUS, Corporate R&D, 4041 1st Street, M/S 41-2A, San Jose, CA 95134; Advances in Particle Removal Technology

9:30-10:00: Rita Vos; IMEC, Kapeldreef 75, B-3001 Leuven, BELGIUM; Advanced Wet Cleaning of Sub-micron Sized Particles

10:00-10:30: COFFEE BREAK

10:30-11:00: Wim Fyen; Chemical Mechanical Polishing - Ultra Clean Processing, IMEC, SPT division, Kapeldreef 75, B-3001 Heverlee, BELGIUM; Influence of Transient pH on Particle Redeposition During Rinse

11:00-11:30: Christopher Beaudry, Jennifer Baker, and Steven Verhaverbeke

Applied Materials, 3050 Bowers Avenue, MS 0104, Santa Clara, CA 95054; Particle Performance of Modified SC-1 Solutions

11:30-12:00: E. S. Geskin and B. Goldenberg; New Jersey Institute of Technology, Newark, NJ 07102-1982; The Use of the Rectangular Jets for Surface Processing

12:00-1:30: LUNCH

SESSION IV: TUESDAY, JUNE 25, 2002

1:30-2:00: Brij M. Moudgil, Yakov I. Rabinovich, Madhavan S. Esayanur and Rajiv K. Singh; Department of Materials Science and Engineering and Engineering Research Center for Particle Science and Technology University of Florida; 205 Particle Science and Technology Bldg., P.O. Box 116135, Gainesville, FL 32611-6135; Particle Adhesion on Nanoscale Rough Surfaces

2:00-2:30: Michael L. Free; Department of Metallurgical Engineering, University of Utah, 135 S. 1460 E. Room 416, Salt Lake City, UT 84112; The Use of Surfactants to Enhance Particle Removal from Surfaces

2:30-3:00: Julius Perel¹, John Mahoney¹, Peter Kopalidis² and Rob Becker ²; 1) Phrasor Scientific Inc.,1536 Highland Ave., Duarte, CA 91010; 2) Axcelis Technologies, Beverly, MA; Particle Removal by Collisions with Energetic Clusters

3:00-3:30: COFFEE BREAK

3:30-4:00: M. Mosbacher, M. Bertsch, V. Dobler, O. Dubbers, F. Lang, H.-J. Muenzer, J. Boneberg, and P. Leiderer; University of Konstanz, Center of Modern Optics, Fach M676, D-78457 Konstanz, GERMANY; Laser Cleaning - a Complex Process

4:00-4:30: Y.F. Lu, Y.W. Zheng , L. Zhang, B. Luk'yanchuyk, W.D. Song, W.J. Wang, M.H. Hong and T.C. Chong; Laser Microprocessing Laboratory, Department of Electrical and Computer Engineering and Data Storage Institute, National University of Singapore, 10 Kent Ridge Crescent, SINGAPORE 119260; Behaviors of Microparticles on Solid Surfaces During Laser Surface Cleaning

4:30-5:00: Cetin Cetinkaya, Richard Vanderwood and Mathew Rowell; Dept. of Mechanical and Aeronautical Engineering, Center for Advanced Materials Processing, Clarkson University, Potsdam, NY 13699-5725; Nanoparticle Removal from Substrates with Pulsed-laser Induced Plasma

SESSION V: WEDNESDAY, JUNE 26, 2002

8:30-9:00: Timothy Piazza and William L. Puskas; CAE Ultrasonics, 9 N. Main St. , Jamestown, NY 14701; Ideal Ultrasonic Parameters for Delicate Parts Cleaning

9:00-9:30: Ahmed Busnaina¹ and Hong Lin ²; 1) NSF Center for Microcontamination Control, Northeastern University, Boston, MA 02115-5000; 2) IBM Microelectronics Division, 32A, Hopewell Junction, NY 12533; Physical Cleaning of Patterned Semiconductor Substrates

9:30-10:00: Ahmed A. Busnaina¹ and Hong Lin²; 1) NSF Center for Microcontamination Control, Northeastern University, Boston, MA 02115-5000; 2) IBM Microelectronics Division, 32A, Hopewell Junction, NY 12533; Removal of Nano and Micro-Scale Particles from Silicon Oxide Substrates

10:00-10:30: COFFEE BREAK

10:30-11:00: Carole LeBlanc; ,TURI, University of Massachusetts, Lowell, 1 University Avenue, Lowell, MA 01854-2866; The Future of Industrial Cleaning and Related Public Policy-Making

11:00-11:30: Stanley Seelig; Dynaloy, Inc., 1910 S. State Avenue, Indianapolis, IN 46203; Removal of Ink Particles from Ceramic Anilox Rolls Used in Flexographic Printing

11:30-12:00: D.Shishkin, E.S. Geskin, B.Goldenberg and O.Petrenko; New Jersey Institute of Technology, Newark, NJ 07102; Ice-air Blasting: Case Studies

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