CALL FOR PAPERS

SECOND INTERNATIONAL SYMPOSIUM ON ADHESION ASPECTS OF THIN FILMS

NOVEMBER 9-11, 2005

SAVANNAH, GA

This is a companion symposium to the SECOND INTERNATIONAL SYMPOSIUM ON ADHESION MEASUREMENT OF THIN FILMS AND COATINGS. This symposium will deal with adhesion aspects of all types of thin films. The symposium will focus on a range of adhesion related concerns dealing with durability and reliability. Particular issues include the determination of the locus of adhesion failure, film-substrate interactions, bond durability against moisture and other deleterious factors, solvent swelling effects and the role of residual stresses on film performance and reliability. This symposium will follow up on the latest developments in this tremendously active field. The primary focus of this meeting will be to provide a forum for the discussion of cutting edge advancements in the field and to review and consolidate the accomplishments which have been achieved thus far.

BOTH ORGANIC AND INORGANIC THIN FILMS ARE OF INTEREST IRRESPECTIVE OF DEPOSITION METHOD

TOPICS OF INTEREST INCLUDE:

Factors influencing adhesion - Residual stress, mechanical properties, contamination ... etc.

Bond durability, corrosion prevention

Adhesion promoters

POLYMERIC FILMS

Plasma polymerized films

Photoresists

Organic insulators

Barrier layers

Effects of aging and environment on adhesion

GENERAL SYSTEMS

Polymer to metal and metal to polymer adhesion

Multilevel laminates involving glass, ceramic, metal and polymer thin films

FUNDAMENTAL ISSUES

Role of surface chemistry, wettability and morphology

Fundamental adhesion mechanisms including film/substrate interactions

This symposium is being organized under the direction of Dr. K. L. Mittal, Editor, Journal of Adhesion Science and Technology by MST Conferences, LLC. A proceedings volume is planned for this symposium and further details will be provided in due course. Please notify the conference chairman of your intentions to present a paper as early as possible. An abstract of about 200 words should be sent June 15, 2005 to the conference chairman by any of the following methods:

E-mail: rhl@mstconf.com

FAX: 212-656-1016

Regular mail:

Dr. Robert H. Lacombe.

Conference Chairman.

3 Hammer Drive

Hopewell Junction, NY 12533

Contact by phone:
845-897-1654
845-227-7026

Full conference details and registration via the Internet will be maintained on our web site:

CLICK HERE TO SUBMIT AN ABSTRACT OR GET ON CONFERENCE MAILING LIST: ONLINE RESPONSE FORM

MST Conferences Webmaster
Your comments and inquiries are most welcome
Address all correspondence to:
rhlacombe@compuserve.com