C A L L F O R P A P E R S



THIRD INTERNATIONAL SYMPOSIUM ON

ADHESIVE JOINTS:

FORMATION,CHARACTERISTICS AND TESTING

Providence Biltmore Hotel, Providence, Rhode Island (USA); June 26-28, 2002

This symposium continues the series of meetings on this topic the first of which was held as a part of the American Chemical Society meeting in Kansas City, 1982. There are a myriad of applications (ranging from aerospace to surgery) where adhesives are used to join different materials, and concomitantly the understanding of the behavior of adhesive joints becomes very important. There are many factors which can influence the behavior of adhesive joints, e.g., interfacial aspects, joint design, mode of stress, etc., and in order to understand the joint behavior in a holistic manner, one must take due cognizance of all these relevant factors. In conformity with the title of the Symposium, it is planned to address not only how to make acceptable joints but their characterization, durability, and testing will be accorded due consideration. The purpose of this Symposium is to provide a forum for discussing the latest developments, identifying areas which need intensified R&D activity, and cross-pollination of ideas. The technical program will comprise both invited and contributed papers, which will be of both overview and original research in nature.
Among the topics to be covered are:

  • Surface Cleaning, Preparation, and Modification for Adhesive Bonding.


  • Contact Angle, Wettability and Adhesive Joint Strength.


  • Understanding of Interfacial Interactions,(e.g., by use of ESCA) and Their Relevance to Joint Strength.


  • Ways to Improve Joint Strength (e.g., Use of Adhesion Promoters).


  • Joint Durability (Effects of Moisture, Corrosives, ... etc.)


  • Characterization of Adhesive Joints.


  • Testing (Both Destructive and Nondestructive) of Adhesive Joints.


  • Fracture Behavior of Adhesive Joints.
This symposium is being organized under the direction of Dr. K. L. Mittal, Editor, Journal of Adhesion Science and Technology by MST Conferences, LLC. A proceedings volume is planned for this symposium and further details will be provided in due course. Please notify the conference chairman of your intentions to present a paper as early as possible. An abstract of about 200 words should be sent by March 1, 2002 to the conference chairman by any of the following methods:

E-mail: rhl@mstconf.com

FAX: 212-656-1016

Regular mail:

Dr. Robert H. Lacombe

Conference Chairman

3 Hammer Drive

Hopewell Junction, NY 12533

Contact by phone: 845-226-1393; 845-227-7026


CLICK HERE TO SUBMIT AN ABSTRACT OR GET ON CONFERENCE MAILING LIST: ONLINE RESPONSE FORM