CALL FOR PAPERS

THIRD INTERNATIONAL SYMPOSIUM ON

ADHESION MEASUREMENT OF THIN FILMS AND COATINGS

To be held November 7-9, 2001 at the

Robert Treat Hotel; Newark, NJ

This symposium continues the tradition set by the first symposium in this series which was held in Boston in 1992. As with its predecessor, this symposium will be concerned with the myriad methods for measuring the adhesion of thin films and coatings. The ability to accurately measure the adhesion of coatings to surfaces is a crucial part of the development and manufacturing process of coatings and films. In addition, the ability to make accurate adhesion measurements requires a fundamental understanding of the physics, chemistry and mechanics of thin films and coatings. This symposium is organized to bring together scientists, technologists and engineers interested in all aspects of adhesion measurement, to review and assess the current state of knowledge, to provide a forum for exchange and cross-fertilization of ideas and to define problem areas which need intensified efforts.

The invited speakers have been selected so as to represent widely differing disciplines and interests, and they hail from academic, governmental and industrial research laboratories. This meeting is planned to be a truly international event both in geographic coverage as well as in spirit. The technical program will contain both invited overviews and contributed original research papers. It is planned to chronicle the transactions in a hard-bound volume of archival quality (to match or exceed the standards of the journal literature) which will serve as a reference work for future generations of investigators.

TOPICS OF INTEREST INCLUDE:

Adhesion measurements in quality control and manufacturing
Adhesion measurements in support of coating process research and development
Adhesion measurement instrumentation for laboratory and manufacturing environments

FUNDAMENTAL ASPECTS OF ADHESION MEASUREMENT

Mechanics of adhesion testing, the role of film stresses

Fracture mechanics of adhesion testing
Physico-chemical aspects of adhesion testing, the role of film morphology and chemistry

ADVANCED TEST AND DATA ANALYSIS METHODS

Qualitative, semiquantitative and fully quantitative analysis methods.
Novel test methods: laser spallation, internal friction, electromagnetic,... etc.
Thermodynamic aspects of adhesion testing, (energy flow and balance, calorimetry, ... etc)

This symposium is being organized by MST Conferences, LLC under the direction of Dr. K. L. Mittal, Editor, Journal of Adhesion Science and Technology. A proceedings volume is planned for this symposium and further details will be provided in due course. Please notify the conference chairman of your intentions to present a paper as early as possible. An abstract of about 200 words should be sent by June 15, 2001 to the conference chairman by any of the following methods:

E-mail: rhl@mstconf.com

FAX: 212-656-1016

Regular mail:

Dr. Robert H. Lacombe

Conference Chairman

3 Hammer Drive

Hopewell Junction, NY 12533

CLICK HERE TO SUBMIT AN ABSTRACT OR GET ON CONFERENCE MAILING LIST: ONLINE RESPONSE FORM

MST Conferences Webmaster
Your comments and inquiries are most welcome
Address all correspondence to:
rhlacombe@compuserve.com