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 C A L L F O R P A P E R S
THIRD INTERNATIONAL SYMPOSIUM ON
ADHESION ASPECTS OF POLYMERIC COATINGS
Providence Biltmore Hotel, Providence, Rhode Island (USA); May 22-24, 2002 |
| This symposium continues the series of meetings on this subject the first
of which was held under the auspices of the Electrochemical Society in
Minneapolis, MN, in 1981. The second was held in Newark NJ in 2000.
The plan is to cover the progress and breakthroughs which have occurred
in the interim. Polymeric coatings are used for a number of purposes,
e.g., decorative, protective, functional (as dielectrics or insulators).
Additionally, a special application of polymeric (organic) coatings is their
use as lithographic materials for making integrated circuit elements. |
Irrespective of the purpose of the coating it must adhere well to the
underlying substrate. The primary purpose of this Symposium is to bring
out the various material/process parameters which influence the
adhesion of polymeric coatings with a primary thrust on polymeric
coatings which are organic in nature. All kinds of polymeric coatings
(including primers and paints) irrespective of thickness (thin, thick, or
bulk) and method of deposition (could be plasma, solution, vapor,... etc.)
on a variety of substrates (metals, oxides, glass, polymers) will be
considered. |
Among the topics to be covered are:
- Substrate cleaning, preparation and modification to improve adhesion
behavior of polymeric coatings.
- Influence of the nature of the substrate material on the adhesion of
polymeric coatings.
- Material properties of polymeric coatings as these influence their
adhesion. Effect of formulation (additives) on adhesion.
- Effect of deposition process parameters on adhesion.
- Understanding interfacial interactions (i.e., mechanism of adhesion)
between polymeric coatings and substrates using sophisticated
techniques, e.g., ESCA.
- Techniques for adhesion measurement of polymeric coatings
- Effects of moisture, corrosives, etc. on the durability/ longevity of the
bond.
- Ways to make water-resistant bonds.
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This symposium is being organized under the direction of Dr. K. L. Mittal,
Editor, Journal of Adhesion Science and Technology by MST Conferences,
LLC. A proceedings volume is planned for this symposium and further
details will be provided in due course. Please notify the conference
chairman of your intentions to present a paper as early as possible. An
abstract of about 200 words should be sent by February 1, 2002 to the
conference chairman by any of the following methods:
E-mail: rhl@mstconf.com
FAX: 212-656-1016
Regular mail:
Dr. Robert H. Lacombe
Conference Chairman
3 Hammer Drive
Hopewell Junction, NY 12533
Contact by phone: 845-226-1393; 845-227-7026
CLICK HERE TO SUBMIT AN ABSTRACT OR GET
ON CONFERENCE MAILING LIST: ONLINE
RESPONSE FORM |