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MST Conferences is pleased to organize this the SIXTH INTERNATIONAL SYMPOSIUM ON POLYIMIDES AND OTHER
HIGH TEMPERATURE POLYMERS. Those interested will be able to stay abreast of the conference details by visiting these web pages for information on the conference schedule, abstracts, attendee list, hotel accommodations and more. In addition two short course dealing with adhesion measurement methods and durability of adhesive joints are planned to coordinate with the conference.
Presenting Author Information regarding audio-visulal support
IMPORTANT INFORMATION FOR AUTHORS WHO WANT TO SUBMIT THEIR PAPER TO THE JOURNAL - POLYMER ENGINEERING AND SCIENCECopyright © 2009, MST Conferences, LLC
Revised -- 9/24/2009
URL: http://mstconf.com/polyimd6.htm