MST CONFERENCES STAFF
HOW TO CONTACT US
OUR ADDRESS
Dr. Kash Mittal, Director
1983 Route 52, Suite C
P.O. Box 1280
Hopewell Junction, NY 12533-1280
Call: Phone 845-897-1654 FAX: (845)897-2361
E-mail: klm@mstconf.com
Dr. Mittal is an internationally recognized authority in the area of surface and interface technology and is currently Director of MST CONFERENCES which sponsors courses and symposia in this field. Dr Mittal is internationally renowned for having edited over 75 books in the areas of adhesion and interface science, surface cleaning, particle adhesion and removal, surfactants, and high temperature polymers. Dr Mittal currently serves or has served on the editorial boards of many journals and is the editor of the Journal of Adhesion Science and Technology. He has received many awards and honors from scientific and technical societies and he was recognized for his contributions by the worldwide adhesion community by organizing the 1st International Congress on Adhesion Science and Technology in his honor on his 50th birthday in Amsterdam, The Netherlands, October 16-20, 1995. More recently, he was honored by the global surfactant community by inaugurating the Kash Mittal Award in the surfactant field in his honor for his large efforts and significant contribution to the field of colloid and interface chemistry.
Dr. Mittal is currently engaged in consulting and giving courses in adhesion science and technology
worldwide. In his current position as the Director of MST CONFERENCES, Dr. Mittal is seeking to provide a focal
point for his broad expertise and organizational skills as a service to the academic and technical community
worldwide by providing symposia and courses on the latest cutting edge developments in materials and interface
science.
OR
Dr. Robert H. Lacombe
3 Hammer Drive
Hopewell Junction, NY 12533
Call: Phone: (845)227-7026
FAX: 212-656-1016
E-mail: rhlacombe@compuserve.com
Dr. Lacombe received his PhD. degree in Macromolecular Science from Case Western Reserve University and was a postdoctoral fellow at the University of Massachusetts working on problems of polymer solution thermodynamics. He was an IBM senior level physicist for 17 years working on hybrid non-intrusive inspection and evaluation techniques, as well as problems of materials compatibility of both semiconductor and microelectronic packaging devices. He is an expert in the area of stress buildup in laminate structures and using the techniques of fracture mechanics in solving problems of delamination and cracking in composite devices. He has been a leader in the areas of materials characterization having published some of the first mechanical response data on monolayer nanostructures in the early 1980's. In addition, he has pioneered innovative uses of large scale computation using finite element methods and has applied this expertise directly to problems affecting product development and manufacturing. Dr. Lacombe is Chairman of MST Conferences and has organized over 20 international symposia since 1998. He is credited with over 40 publications and patents. Dr. Lacombe is a leading innovator in the field of subsurface inspection methods dealing with flaws in structural parts of aircraft, auto, marine and aerospace vehicles. As part of his activities with MST CONFERENCES he gives a semiannual course on ADHESION MEASUREMENT METHODS in conjunction with the symposia and is currently completing a 430-page volume on ADHESION MEASUREMENT METHODS: THEORY AND PRACTICE to be published by Taylor Francis in late 2005.
Copyright © 1999, MST Conferences, LLC
Revised -- 8/29/2005
URL: http://mstconf.com/staff.htm